05280414 is referenced by 22 patents and cites 20 patents.

A method is disclosed of simultaneously laminating circuitized dielectric layers to form a multilayer high performance circuit board and making interlevel electrical connections. The method selects two elements which will form a eutectic at one low temperature and will solidify to form an alloy which will only remelt at a second temperature higher than any required by any subsequent lamination. The joint is made using a transient liquid bonding technique and sufficient Au and Sn to result in a Au-Sn20wt% eutectic at the low temperature. Once solidified, the alloy formed remains solid throughout subsequent laminations. As a result, a composite, multilayer, high performance circuit board is produced, electrically joined at selected lands by the solid alloy.

Title
Au-Sn transient liquid bonding in high performance laminates
Application Number
7/536145
Publication Number
5280414
Application Date
June 11, 1990
Publication Date
January 18, 1994
Inventor
Jonathan D Reid
Johnson City
NY, US
Jae M Park
Somers
NY, US
James R Loomis
Binghamton
NY, US
Richard Hsiao
Vestal
NY, US
Charles R Davis
Endicott
NY, US
Agent
Judith D Olsen
Bernard Tiegerman
Assignee
International Business Machines
NY, US
IPC
B32B 31/00
H05K 1/11
H05K 3/36
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