05272593 is referenced by 19 patents and cites 8 patents.

The housing for an electronic circuit is box-shaped, and on each of its longitudinal sides in its interior has a shoulder (44, 45), and above each of those a ridge (47, 48) and -- extending along a longitudinal side. A cooling frame (11) is pushed into the grooves (52, 53) formed between shoulder and ridge, with a printed circuit board (10) being fixed to the underside of the cooling frame. In its interior, the cooling frame has cooling tabs (15, 16, 17) which stand perpendicular to the surface of the printed circuit board and on which power components (20) are fixed.

Title
Housing for an electronic circuit with improved heat dissipation means
Application Number
7/941068
Publication Number
5272593
Application Date
October 8, 1992
Publication Date
December 21, 1993
Inventor
Dieter Karr
Tiefenbronn
DE
Thomas Jessberger
Eberdingen/Hochdorf
DE
Dieter Hussmann
Steinheim
DE
Karl Schupp
Pforzheim
DE
Gert Jakob
Stuttgart
DE
Agent
Michael J Striker
Assignee
Robert Bosch
DE
IPC
H05K 7/20
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