05264324 is referenced by 2 patents and cites 19 patents.

The present invention relates to a radiation-polymerizable mixture which includes a polymerizable compound, a polymeric binder which has units of methacrylic acid, a methacrylic acid ester and a styrene, the latter in a proportion of 40 to 65% by weight, a finely divided mineral pigment on a silicic acid or silicate basis, a photopolymerization initiator, a compound having at least two epoxy groups in its molecule and a thermal hardener for epoxy groups. The mixture is advantageous, in particular, for producing solder masks and can be cured after exposure to an image and development by heating to about 80.degree. to 150.degree. C. to form a stencil which is resistant under soldering conditions.

Title
Radiation-polymerizable mixture and process for producing a solder resist mask
Application Number
7/585642
Publication Number
5264324
Application Date
September 20, 1990
Publication Date
November 23, 1993
Inventor
Rudolf Decker
Bodenheim
DE
Kurt Erbes
Floersheim
DE
Walter Herwig
Bad Soden
DE
Michael Emmelius
Mainz
DE
Agent
Foley & Lardner
Assignee
Hoechst Aktiengesellschaft
DE
IPC
G03C 1/68
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