05262356 is referenced by 18 patents and cites 16 patents.

A method of treating a substrate with substantially equal flow rates of treatment gases in a treatment chamber containing the substrate. Because the times during which the treatment gases pass through pipes are controlled, even when the flow rates of the treatment gases differ appreciably, the impurity concentration in a film near the interface between the substrate and the film reaches a desired concentration. Also, when the times during which the treatment gases pass through the pipes are short, the treatment gases are unlikely to adhere to the walls of the pipes. It is thus possible to reduce the frequency of dummy runs.

Title
Method of treating a substrate wherein the flow rates of the treatment gases are equal
Application Number
7/674978
Publication Number
5262356
Application Date
March 26, 1991
Publication Date
November 16, 1993
Inventor
Atsuhiro Fujii
Itami
JP
Agent
Leydig Voit & Mayer
Assignee
Mitsubishi Denki Kabushiki Kaisha
JP
IPC
G01L 21/463
G01L 21/302
G01L 21/02
G01L 21/00
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