05261153 is referenced by 139 patents and cites 35 patents.

An in situ method for forming a bypass capacitor element internally within a PCB comprising the steps of arranging one or more uncured dielectric sheets with conductive foils on opposite sides thereof and laminating the conductive foils to the dielectric sheet simultaneously as the PCB is formed by a final lamination step, the conductive foils preferably being laminated to another layer of the PCB prior to their arrangement adjacent the dielectric sheet or sheets, the dielectric foils even more preferably being initially laminated to additional dielectric sheets in order to form multiple bypass capacitive elements as a compound subassembly within the PCB.

Title
In situ method for forming a capacitive PCB
Application Number
7/864440
Publication Number
5261153
Application Date
April 6, 1992
Publication Date
November 16, 1993
Inventor
Gregory L Lucas
Newark
CA, US
Agent
John A Bucher
Assignee
Zycon Corporation
CA, US
IPC
H05K 3/36
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