05252853 is referenced by 275 patents and cites 8 patents.

A packaged semiconductor device having an LOC structure, a thin body, and good electrical characteristics employs a TAB tape. A semiconductor chip carries ground pads arranged in a row, power pads arranged in another row, and signal pads arranged in two rows on both sides of the rows of ground and power pads. A shared ground lead and a shared power lead extend along and are connected to ground pads and power pads, respectively.

Title
Packaged semiconductor device having tab tape and particular power distribution lead structure
Application Number
7/944242
Publication Number
5252853
Application Date
September 14, 1992
Publication Date
October 12, 1993
Inventor
Kazunari Michii
Itami
JP
Agent
Leydig Voit & Mayer
Assignee
Mitsubishi Denki Kabushiki Kaisha
JP
IPC
H01L 23/48
View Original Source