05241456 is referenced by 295 patents and cites 27 patents.

An improved high density interconnect structure may include electronic components mounted on both sides of its substrate or a substrate which is only as thick as the semiconductor chips which reduces the overall structure thickness to the thickness of the semiconductor chips plus the combined thickness of the high density interconnect structure's dielectric and conductive layers. In the two-sided structures, feedthroughs, which are preferably hermetic, provide connections between opposite sides of the substrate. Substrates of either of these types may be stacked to form a three-dimensional structure. Means for connecting between adjacent substrates are preferably incorporated within the boundaries of the stack rather than on the outside surface thereof.

Title
Compact high density interconnect structure
Application Number
7/548462
Publication Number
5241456
Application Date
July 2, 1990
Publication Date
August 31, 1993
Inventor
Robert J Wojnarowski
Ballston Lake
NY, US
Charles W Eichelberger
Schenectady
NY, US
Walter M Marcinkiewicz
Schenectady
NY, US
Agent
Marvin Snyder
Assignee
General Electric Company
NY, US
IPC
H01L 23/053
H01L 23/051
H01L 23/043
H05K 1/00
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