05241454 is referenced by 135 patents and cites 20 patents.

An electronic package which includes a rigid first substrate (e.g., ceramic) having a plurality of conductive pins spacedly located therein. These pins each include one end portion extending below an undersurface of the substrate for positioning and electrically coupling within a second substrate (e.g., printed circuit board), while also including an opposite end portion which projects from an opposite, upper surface of the first substrate. These upwardly projecting end portions are designed for accommodating, in stacked orientation, a plurality of thin film, flexible circuitized substrates thereon, each of these substrates being electrically coupled to a respective pin, if desired, using a solder composition. In one example of the invention, solder hierarchy for various solders is used, one solder being used to connect the substrates and respective pins, and a second solder (having a higher melting point and different composition from the first solder) used to connect the semiconductor devices (chips) of the flexible circuitized substrates to the conductive circuitry of the substrates. Hydrogen is preferably used to effect solder reflow for the solder which couples the flexible substrates to the respective pins. In an alternate embodiment, the flexible circuitized substrates may include at least two separate conductive layers as part thereof.

Title
Mutlilayered flexible circuit package
Application Number
7/823914
Publication Number
5241454
Application Date
January 22, 1992
Publication Date
August 31, 1993
Inventor
David W Sissenstein Jr
Endwell
NY, US
Joseph Funari
Vestal
NY, US
Joseph G Ameen
Apalachin
NY, US
Agent
Lawrence R Fraley
Assignee
International Business Machines Corporation
NY, US
IPC
H05K 7/00
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