05239198 is referenced by 273 patents and cites 8 patents.

A low cost manufacturing method is used to fabricate a small multiple chip semiconductor device (10). In one embodiment, a first pattern of conductive traces (14) is formed on one surface of a substrate (12), and a second pattern of traces (16) is formed on a second surface of the substrate (12). A first semiconductor die (20) is interconnected to the first traces (14), and a package body (24) is formed around the first die and a portion of the traces. A second semiconductor die (26) is interconnected to the second traces (16) on the second surface. A second package body (28) is formed around the second die and a portion of the traces (16). Solder balls (32) are coupled to exposed portions of the second traces (16) around the perimeter of the package body (28) to establish external power and ground connections to each die. Edge leads (36) are externally soldered to the traces (14 & 16) around the periphery of the substrate (12) to establish remaining electrical connections.

Title
Overmolded semiconductor device having solder ball and edge lead connective structure
Application Number
576255
Publication Number
5239198
Application Date
July 2, 1992
Publication Date
August 24, 1993
Inventor
Michael B McShane
Austin
TX, US
Paul T Lin
Austin
TX, US
Agent
James L Clingan Jr
Assignee
Motorola
IL, US
IPC
H01L 23/48
H01L 23/14
H01L 23/12
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