05239126 is referenced by 20 patents and cites 4 patents.

A high-frequency circuit package including a conductive substrate, and upper and lower shielding cases which come tightly into contact with opposite surfaces of the conductive substrate to define therein upper and lower shielding chambers. High-frequency circuits are mounted on the surfaces of the conductive substrate within the upper and lower chambers, respectively.

Title
High-frequency circuit package
Application Number
7/641867
Publication Number
5239126
Application Date
January 16, 1991
Publication Date
August 24, 1993
Inventor
Katsuyuki Oshiba
Kanagawa
JP
Agent
Hill Steadman & Simpson
Assignee
Sony Corporation
JP
IPC
H02G 3/18
H05K 9/00
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