05237743 is referenced by 52 patents and cites 24 patents.

A method of forming conductive end portions on a flexible circuit member having a dielectric layer (e.g., polyimide) with at least one conductive element (e.g., copper) thereon. The method comprises the steps of forming (e.g., punching) an opening through both dielectric and conductive element, providing (e.g., additive plating) an electrically conducting layer on the opening's internal surface, providing (e.g., electroplating) a plurality of dendritic elements on the conducting layer's surface, and thereafter removing (e.g., punching) a portion of the dielectric and conductive element such that the formed dendritic elements (e.g., palladium) project from the flexible circuit's conductive ends.

Title
Method of forming a conductive end portion on a flexible circuit member
Application Number
7/901054
Publication Number
5237743
Application Date
June 19, 1992
Publication Date
August 24, 1993
Inventor
Robert D Topa
Binghamton
NY, US
George J Saxenmeyer Jr
Apalachin
NY, US
Jaynal A Molla
Endicott
NY, US
David W Dranchak
Endwell
NY, US
Fletcher W Chapin
Vestal
NY, US
Raymond A Busacco
Lake Ariel
PA, US
Agent
Lawrence R Fraley
Assignee
International Business Machines Corporation
NY, US
IPC
H01R 43/16
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