05234867 is referenced by 136 patents and cites 11 patents.

An apparatus for planarizing semiconductor wafers in its preferred form includes a rotatable platen for polishing a surface of the semiconductor wafer and a motor for rotating the platen. A non-circular pad is mounted atop the platen to engage and polish the surface of the semiconductor wafer. A polishing head holds the surface of the semiconductor wafer in juxtaposition relative to the non-circular pad. A polishing head displacement mechanism moves the polishing head and semiconductor wafer across and past a peripheral edge of the non-circular pad to effectuate a uniform polish of the semiconductor wafer surface. Also disclosed is a method for planarizing a semiconductor surface using a non-circular polishing pad.

Title
Method for planarizing semiconductor wafers with a non-circular polishing pad
Application Number
7/889521
Publication Number
5234867
Application Date
May 27, 1992
Publication Date
August 10, 1993
Inventor
Trung T Doan
Boise
ID, US
Mark E Tuttle
Boise
ID, US
Laurence D Schultz
Boise
ID, US
Agent
Wells St John Roberts Gregory & Matkin
Assignee
Micron Technology
ID, US
IPC
H01L 21/463
H01L 21/302
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