05234561 is referenced by 85 patents and cites 17 patents.

A machine for covering a substrate (FIG. 14, 540) by means of both cathodic arc plasma deposition (CAPD) (FIG. 2) and magnetron sputtering (FIG. 1) without breaking vacuum in a single chamber (FIG. 14, 421). A computer system monitors (FIG. 3, 403, 405) and controls all coating process parameters to coat in any sequence multiple thin film layers using either the CAPD or magnetron sputtering process. A rotating substrate table (FIG. 14, 470) used in conjunction with internal and external targets coats both sides of the substrate simultaneously.

Title
Physical vapor deposition dual coating process
Application Number
7/236648
Publication Number
5234561
Application Date
August 25, 1988
Publication Date
August 10, 1993
Inventor
Jeffrey M Buske
Boulder
CO, US
Harbhajan S Randhawa
Boulder
CO, US
Agent
Beaton & Swanson
Assignee
Hauzer
NL
IPC
C23C 14/32
C23C 14/34
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