05229916 is referenced by 112 patents and cites 10 patents.

A chip overlay element is formed of a flexible substrate of polymer having electrically conductive material applied to one side thereof and circuitized to form signal lines. A metal stiffener/heat spreader is laminated to the polymer on the opposite side of the conductor. I/Os are formed on one end of the signal lines of the circuitized layer (near the end of the overlay element) and interconnection pads, bumps, or the like are formed on the opposite end (near the center of the element). The metal stiffener is then etched to form three distinct areas. The chip edge is then placed on the center metal stiffener area and bonded, with the other two stiffener areas being bent around the chip and bonded to the corresponding chip sides. The original I/Os are then electrically connected to the I/Os formed on the signal lines of the overlay element.

Title
Chip edge interconnect overlay element
Application Number
7/846301
Publication Number
5229916
Application Date
March 4, 1992
Publication Date
July 20, 1993
Inventor
Ronald L Imken
Round Rock
TX, US
Richard F Frankeny
Austin
TX, US
Agent
Mark E McBurney
Assignee
International Business Machines Corporation
NY, US
IPC
H05K 7/20
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