05228501 is referenced by 195 patents and cites 16 patents.

A clamping ring and temperature regulated platen for clamping a wafer to the platen and regulating the temperature of the wafer. The force of the clamping ring against the wafer is produced by the weight of the clamping ring. A roof shields all but a few contact regions of the interface between the wafer and clamp from receiving depositing particles so that a coating formed on the wafer makes continuous contact with the clamping ring in only a few narrow regions that act as conductive bridges when the depositing layer is conductive.

Title
Physical vapor deposition clamping mechanism and heater/cooler
Application Number
944843
Publication Number
5228501
Application Date
September 2, 1992
Publication Date
July 20, 1993
Inventor
Dana Andrews
Mountain View
CA, US
Howard Grunes
Santa Cruz
CA, US
Avi Tepman
Cupertino
CA, US
Agent
John A Frazzini
Assignee
Applied Materials
CA, US
IPC
F28F 7/00
View Original Source