05225969 is referenced by 45 patents and cites 21 patents.

A multilayer hybrid circuit having a laminated body having at least one of a plurality of dielectric layers, dielectric magnetic layers, and conductive patterns on said dielectric layers and said magnetic layers, is produced through a printing process and a sintering process, and comprises capacitors, inductors, and resistors. An external connection is effected by side terminals positioned on side walls of the laminated body. A coupling conductor which is perpendicular to a dielectric plane is provided for coupling elements on different planes. Said coupling conductor is a succession of essentially S-shaped conductor chips or lines with the ends connected to adjacent conductor chips on different planes. That coupling conductor functions via a through hole conductor in a prior printed circuit board, and has high operational reliability in a component which is produced through a sintering process. In one embodiment, an inductor is produced by a pair of coils connected in series with each other to reduce the thickness of the laminated body while providing high inductance.

Title
Multilayer hybrid circuit
Application Number
7/627692
Publication Number
5225969
Application Date
December 14, 1990
Publication Date
July 6, 1993
Inventor
Katsuharu Yasuda
Tokyo
JP
Yoshinori Mochizuki
Ichikawa
JP
Minoru Takaya
Ichikawa
JP
Agent
Martin Novack
Assignee
TDK Corporation
JP
IPC
H05K 1/16
H05K 1/11
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