A multilayer hybrid circuit having a laminated body having at least one of a plurality of dielectric layers, dielectric magnetic layers, and conductive patterns on said dielectric layers and said magnetic layers, is produced through a printing process and a sintering process, and comprises capacitors, inductors, and resistors. An external connection is effected by side terminals positioned on side walls of the laminated body. A coupling conductor which is perpendicular to a dielectric plane is provided for coupling elements on different planes. Said coupling conductor is a succession of essentially S-shaped conductor chips or lines with the ends connected to adjacent conductor chips on different planes. That coupling conductor functions via a through hole conductor in a prior printed circuit board, and has high operational reliability in a component which is produced through a sintering process. In one embodiment, an inductor is produced by a pair of coils connected in series with each other to reduce the thickness of the laminated body while providing high inductance.