05224023 is referenced by 161 patents and cites 14 patents.

An electronic assembly combines a number of commensurate printed circuit boards bonded to a common, flexible, interconnecting substrate in an alternately folded and layered arrangement against an end board that has a comb of terminals for mounting into a motherboard connector. The flexible substrate is sandwiched between half-sections of each board, allowing mounting of components from both faces of the board. The assembly is particularly indicated for high density applications such as memory modules.

Title
Foldable electronic assembly module
Application Number
7/833997
Publication Number
5224023
Application Date
February 10, 1992
Publication Date
June 29, 1993
Inventor
Chris Karabatsos
42 Jumping Brook La., Kingston, 12401
NY, US
Gary W Smith
12376 Oakwood Rd., San Diego, 92129
CA, US
Agent
Henri J A Charmasson
IPC
H05R 1/11
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