A method and apparatus for achieving lead-on-chip integrated circuit packages by transferring at least one extremely thin adhesive from a carrier onto the face of integrated circuit chips, laminating a lead frame to the last adhesive layer, curing the adhesive to act as an insulator, bonding to the integrated circuit chip connection pads and encapsulating the chip and lead frame. A polypropylene carrier having adhesive patches pre-shaped and oriented in relation to the integrated circuit chips is brought into contact with the heated chips by either vacuum or pressure action wherein the adhesive is transferred from the polypropylene carrier to the faces of the chips. Thermally conductive and electrically insulating filling may be used with the adhesive to improve heat conduction from the IC. Compliant adhesive reduces thermally induced stresses between the lead frame and IC chip. Both the improved thermal performance and reduced moisture absorption of the encapsulated package improves the reliability of the integrated circuit package.