An electrical circuit package wherein a flexible support member having conductive materials and electronic components thereon is fused with a substrate which acts as a support for the film. This results in a unitary packaged circuit. In one embodiment the film is a decal on which certain portions have a substrate fused thereto. In other embodiments, various layers of conductive materials are applied and molded into the substrate to form a variety of electronic functions. The circuit package lends itself to high production and reliability as well as cost savings.