05220488 is referenced by 95 patents and cites 40 patents.

An electrical circuit package wherein a flexible support member having conductive materials and electronic components thereon is fused with a substrate which acts as a support for the film. This results in a unitary packaged circuit. In one embodiment the film is a decal on which certain portions have a substrate fused thereto. In other embodiments, various layers of conductive materials are applied and molded into the substrate to form a variety of electronic functions. The circuit package lends itself to high production and reliability as well as cost savings.

Title
Injection molded printed circuits
Application Number
71267
Publication Number
5220488
Application Date
April 27, 1992
Publication Date
June 15, 1993
Inventor
Oscar L Denes
Greendale
WI, US
Agent
Quarles & Brady
Assignee
UFE Incorporated
MN, US
IPC
H05K 1/03
H05K 3/02
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