A gel composition including a gel matrix with a thickener having a water absorbent polymer with pendent anionic groups dispersed therein. Preferred thickeners are organophilic clays such as bentonite and mixtures of such clays with waxes, silica and/or ethylene or polyethylene microspheres.
The gel composition is activated with moisture so that the water absorbent polymer migrates to engage and absorb the water. The composition can be used to protect enclosed components or contents from water damage. Also, the gel composition protects wires which carry a small dc current such as the wires of telecommunication cables and splices. The composition eliminates shorts caused by water contact with such wires.