05214845 is referenced by 292 patents and cites 3 patents.

This invention creates a high speed semiconductor interconnect system which contains a plurality of signal traces, each in a flexible printed circuit, and each adhesively sandwiched between or adjacent to a flexible ground circuit and a flexible power circuit. The signal, power and ground circuits are stacked in multilayers and are connected to respective lead fingers and respective die circuits by standard, known methods such as TAB or wire bond and encapsulated in a known way. The ground plane and power plane being adjacent to the signal plane reduces the power-ground loop inductance and thus reduces the package noise. By reducing the inductance, the circuit can have a shorter switching time. Also, by adding the ground plane, the power-ground capacitance is increased, which serves to reduce the effect of power supply fluctuations in the system.

Title
Method for producing high speed integrated circuits
Application Number
7/881456
Publication Number
5214845
Application Date
May 11, 1992
Publication Date
June 1, 1993
Inventor
Chender Huang
Boise
ID, US
Walter L Moden
Boise
ID, US
Jerrold L King
Boise
ID, US
Agent
Wayne E Duffy
Assignee
Micron Technology
ID, US
IPC
H01L 23/28
H05K 3/30
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