05214308 is referenced by 285 patents and cites 3 patents.

A substrate for packaging a semiconductor device having a bump thereon according to the present invention is characterized by that the substrate has an electrode terminal to which the bump is to be connected, and a recess for receiving at least a top of the bump is formed in the electrode terminal.

Title
Substrate for packaging a semiconductor device
Application Number
7/644587
Publication Number
5214308
Application Date
January 23, 1991
Publication Date
May 25, 1993
Inventor
Atsushi Miki
Yokohama
JP
Masanori Nishiguchi
Yokohama
JP
Agent
Cushman Darby & Cushman
Assignee
Sumitomo Electric
JP
IPC
H01L 21/44
H01L 23/48
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