05207613 is referenced by 60 patents and cites 32 patents.

A high density electronic module packaging system includes a cabinet for housing a plurality of modules. Disposed at the rear of the cabinet and forming a rear wall thereof is a cooling system housing that is used for cooling the modules contained in the cabinet. Disposed within the cabinet are a plurality, e.g., four, cooling modules; a power distribution unit having a plurality, e.g., twelve, power converters; and a plurality, e.g., twenty-eight electronic modules. The number of cooling modules, power converters and electronic modules may be added or subtracted as needed or desired. The cooling modules flow cooling fluid to and/or from the power distribution unit and/or to the plurality of electronic modules. The power distribution unit supplies power to the plurality of electronic modules. The electronic modules may house one or more submodules such as storage devices (e.g., disk drives) or printed circuit boards.

Title
Method and apparatus for mounting, cooling, interconnecting, and providing power and data to a plurality of electronic modules
Application Number
7/726616
Publication Number
5207613
Application Date
July 8, 1991
Publication Date
May 4, 1993
Inventor
Victor Trujillo
Fremont
CA, US
Joerg Ferchau
Morgan Hill
CA, US
Agent
Townsend and Townsend
Assignee
Tandem Computers Incorporated
CA, US
IPC
H05K 7/20
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