05207585 is referenced by 168 patents and cites 21 patents.

A thin interface pellicle probe for making temporary or permanent interconnections to pads or bumps on a semiconductor device wherein the pads or bumps may be arranged in high density patterns is described incorporating an electrode for each pad or bump wherein the electrode has a raised portion thereon for penetrating the surface of the pad or bump to create sidewalls to provide a clean contact surface and the electrode has a recessed surface to limit the penetration of the raised portion. The electrodes may be affixed to a thin flexible membrane to permit each contact to have independent movement over a limited distance and of a limited rotation. The invention overcomes the problem of making easily breakable electrical interconnections to high density arrays of pads or bumps on integrated circuit structures for testing, burn-in or package interconnect and testing applications.

Title
Thin interface pellicle for dense arrays of electrical interconnects
Application Number
7/606413
Publication Number
5207585
Application Date
October 31, 1990
Publication Date
May 4, 1993
Inventor
Eugene Shapiro
Stamford
CT, US
Michael R Scheuermann
Katonah
NY, US
Jean Marc Halbout
Larchmont
NY, US
Herbert P Byrnes
Poughkeepsie
NY, US
Agent
Robert M Trepp
Assignee
International Business Machines Corporation
NY, US
IPC
H01R 9/09
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