05200364 is referenced by 39 patents and cites 6 patents.

An integrated circuit device is disclosed. The device includes a first leadframe power supply bus and a second leadframe power supply bus that each have portions separate from and adjacent to one another that lie between a first plurality of leadfingers and a second plurality of leadfingers. An electronic device is connected to the first leadframe power supply bus and to the second leadframe power supply bus. Another electronic device can be connected to the first leadframe power supply bus and to the second leadframe bus. Exemplary of the electronic devices are a de-coupling capacitor and a capacitor for high frequency noise suppression. A semiconductor die is attached to the power supply busses. A substance encapsulates the components so that an integrated semiconductor chip is formed. A method of making an integrated circuit device is also disclosed.

Title
Packaged integrated circuit with encapsulated electronic devices
Application Number
470673
Publication Number
5200364
Application Date
January 21, 1992
Publication Date
April 6, 1993
Inventor
Wah K Loh
Richardson
TX, US
Agent
Richard Donaldson
Leo Heiting
Richard B Havill
Assignee
Texas Instruments Incorporated
TX, US
IPC
H01L 21/60
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