05196726 is referenced by 169 patents and cites 5 patents.

A substrate for packaging a semiconductor device having a bump thereon according to the present invention is characterized by that the substrate has an electrode terminal to which the bump is to be connected, the electrode terminal has a recess formed thereon to the receive at least a top of the bump, and at least a top of the surface of the electrode terminal is covered by a metal layer having a lower melting point than that of the bump.

Title
Substrate for packaging a semiconductor device having particular terminal and bump structure
Application Number
7/644846
Publication Number
5196726
Application Date
January 23, 1991
Publication Date
March 23, 1993
Inventor
Atsushi Miki
Yokohama
JP
Masanori Nishiguchi
Yokohama
JP
Agent
Cushman Darby & Cushman
Assignee
Sumitomo Electric
JP
IPC
H01L 23/54
H01L 23/14
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