05185073 is referenced by 82 patents and cites 45 patents.

A separable and reconnectable connection for electrical equipment is provided that is suitable for miniaturization in which vertical interdigitating members integrally attached and protruding from a planar portion are accommodated in control of damage in lateral displacement that occurs on mating with an opposite similar contact. Displacement damage is averted through accommodating lateral stresses by providing one or more of a conformal opposing contact, by strengthening through coating and base reinforcement and a deformable coating. The contacts are fabricated by physical and chemical processes including sputtering, normal and pulse electroplating and chemical vapor deposition. Pulse electroplating of palladium provides a dendritic deposit of uniform height, uniform rounded points and less branching. The contacts on completion are provided with a surrounding immobilizing material that enhances rigidity.

Title
Method of fabricating nendritic materials
Application Number
209667
Publication Number
5185073
Application Date
April 29, 1991
Publication Date
February 9, 1993
Inventor
George F Walker
New York
NY, US
Jack A Varcoe
Endwell
NY, US
George J Saxenmeyer Jr
Apalachin
NY, US
John J Ritsko
Mount Kisco
NY, US
Douglas O Powell
Endicott
NY, US
Jaynal A Molla
Endicott
NY, US
Ekkehard F Miersch
Schoenaich
DE
Voya R Markovich
Endwell
NY, US
David N Light
Friendsville
PA, US
Paul Lauro
Pomona
NY, US
Jungihl Kim
Chappaqua
NY, US
Sung K Kang
Chappaqua
NY, US
Anthony P Ingraham
Endicott
NY, US
Thomas P Gall
Endwell
NY, US
Jerome J Cuomo
Lincolndale
NY, US
Perminder S Bindra
South Salem
NY, US
Agent
Alvin J Riddles
Daniel P Morris
Assignee
International Business Machines Corporation
NY, US
IPC
C25D 5/18
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