05179501 is referenced by 73 patents and cites 19 patents.

An electronic module assembly includes a relatively thin, bendable base plate having at least one bend axis along which the base plate is bent over on itself to provide an enclosure. An inner surface of the base plate supports at least one, and preferably two, relatively thicker metal plates, one on each side of the bend axis, each metal plate acting as a heatsink for circuit components mounted thereon.

Title
Laminated electronic module assembly
Application Number
7/840247
Publication Number
5179501
Application Date
February 24, 1992
Publication Date
January 12, 1993
Inventor
Michael I Petrites
Schaumburg
IL, US
Timothy S Fisher
Chicago
IL, US
Nathan A Unterman
Chicago
IL, US
Alfred G Ocken
Palatine
IL, US
Agent
John H Moore
Assignee
Motorola
IL, US
IPC
H05K 7/20
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