05173840 is referenced by 85 patents and cites 10 patents.

An IC card includes a thin plate forming an external surface of the card, a circuit board formed on an internal surface of the thin plate, and a frame surrounding peripheries of the thin plate and the circuit board. A space defined by the frame and the surface plate is filled with molded resin. A portion of an inner peripheral surface of the frame projects into the resin. The molded resin completely covers a surface of the circuit board and integrates the frame and the thin plate.

Title
Molded IC card
Application Number
7/691304
Publication Number
5173840
Application Date
April 25, 1991
Publication Date
December 22, 1992
Inventor
Osamu Murakami
Hyogo
JP
Katsunori Ochi
Hyogo
JP
Shojiro Kodai
Hyogo
JP
Agent
Lowe Price LeBlanc & Becker
Assignee
Mitsubishi Denki Kabushiki Kaisha
JP
IPC
H05K 1/14
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