05164699 is referenced by 29 patents and cites 1 patents.

Via resistor structures in a hybrid multilayer circuit having a plurality of insulating layers. One via resistor structure includes a plurality of resistive via fills in vias in respective adjacent insulating layers, a plurality of conductive elements for electrically contacting predetermined tops and bottoms of the resistive via fills, and conductive via fills for providing external electrical connection to selected ones of the conductive elements at locations on the outside the unitized multilayer circuit structure. A further via resistor structure includes a resistive via fill formed in a via in one of the insulating layers, and one or more thermally conductive via fills for thermally conducting heat from said resistive via fill to the outside of the unitized multilayer circuit structure. Another via resistor structure comprises ratioed via resistors comprising a plurality of resistive via fills formed in respective vias in one of the insulating layers, said vias having substantially the same thickness and having respective cross-sectional areas selected to provide resistance values having predetermined ratios.

Title
Via resistors within-multi-layer, 3 dimensional structures substrates
Application Number
7/628813
Publication Number
5164699
Application Date
December 17, 1990
Publication Date
November 17, 1992
Inventor
Raymond Brown
Fountain Valley
CA, US
Andrew A Shapiro
Orange
CA, US
Robert F McClanahan
Valencia
CA, US
Hal D Smith
Rancho Palos Verdes
CA, US
Agent
Wanda K Denson Low
Leonard A Alkov
Assignee
Hughes Aircraft Company
CA, US
IPC
H01C 1/012
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