05163834 is referenced by 59 patents and cites 10 patents.

An electrical connector for interconnecting a pair of circuit members (e.g., circuit module and printed circuit board) which assures highly reliable yet separable connections for these members. The connector includes an electrically insulative (e.g., plastic) frame which defines an internal opening therein. Bridging this opening are a plurality of individual, resilient contact members which are maintained in a suspended and spaced orientation within the opening by a plurality of pairs of elongated insulative members (e.g., polymer rods). Each of the contacts is thus readily removable from the connector's frame to thus facilitate repair and/or replacement. As described, the connector is capable of providing wiping connections, thus assuring removal of debris or other contaminants from the respective conductive pads for each circuit member. In another embodiment, the connector includes a common carrier (e.g., plastic) having therein a plurality of cylindrical shaped resilient contact members (e.g., silicone) which further include a quantity of conductive (e.g., metallic) particles therein. To assure a wiping form of engagement with the respective conductive pads, each of the terminal ends of each contact member preferably includes a plurality of dendritic, interdigitated members thereon.

Title
High density connector
Application Number
628057
Publication Number
5163834
Application Date
July 23, 1991
Publication Date
November 17, 1992
Inventor
Thomas G Macek
Endicott
NY, US
Richard R Hall
Endwell
NY, US
David E Engle
Vestal
NY, US
David W Dranchak
Endwell
NY, US
Fletcher W Chapin
Vestal
NY, US
Agent
Lawrence R Fraley
Assignee
International Business Machines Corporation
NY, US
IPC
H01R 9/09
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