05162613 is referenced by 31 patents and cites 23 patents.

Interconnection of each of a plurality of bond sites (14) on a semiconductor chip (10) to a corresponding one of a plurality of metallized areas (16) on a substrate (12) is accomplished via a sheet of anisotropically conductive material (18) sandwiched therebetween. The anisotropically conductive material advantageously has a cutout (24) therein located to expose at least a portion of the substrate lying between a pair of metallized areas (16). The cutout (24) serves to confine a quantity of adhesive (26) deposited therein which serves to secure the chip to the substrate without any physical bond between the metallized areas and the bond sites on the chip while maintaining the anisotropically conductive material in compression.

Title
Integrated circuit interconnection technique
Application Number
7/724080
Publication Number
5162613
Application Date
July 1, 1991
Publication Date
November 10, 1992
Inventor
David Schoenthaler
Yardley
PA, US
Agent
Robert B Levy
Assignee
AT&T Bell Laboratories
NJ, US
IPC
H01R 9/09
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