05161093 is referenced by 134 patents and cites 8 patents.

A high density interconnect structure incorporating a plurality of laminated dielectric layers is fabricated using a SPI/epoxy crosslinking copolymer blend adhesive in order to maintain the stability of the already fabricated structure during the addition of the later laminations while also maintaining the repairability of the high density interconnect structure.

Title
Multiple lamination high density interconnect process and structure employing a variable crosslinking adhesive
Application Number
7/546959
Publication Number
5161093
Application Date
July 2, 1990
Publication Date
November 3, 1992
Inventor
Robert J Wojnarowski
Ballston Lake
NY, US
Stanton E Weaver Jr
Northville
NY, US
Thomas B Gorczyca
Schenectady
NY, US
Agent
Marvin Snyder
Assignee
General Electric Company
NY, US
IPC
H05K 1/11
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