05157480 is referenced by 274 patents and cites 9 patents.

A semiconductor device having both bottom-side contacts and peripheral contacts provides surface mounting options. In one form, a semiconductor device die is positioned at a die receiving area of a leadframe. The leadframe also has a plurality of leads, each lead having a first and a second contact portion which are separated by an intermediate portion. A package body encapsulates the semiconductor device die and intermediate portions of the plurality of leads. The first contact portions of the leads are partially exposed on the bottom surface of the package body. The second contact portions extend from the package body along a portion of the package body perimeter. The first contact portions provide bottom-side contacts to the device, while the second contact portions provide peripheral contacts. The second contact portions are shaped into a desired lead configuration or are severed to establish a leadless device.

Title
Semiconductor device having dual electrical contact sites
Application Number
7/651166
Publication Number
5157480
Application Date
February 6, 1991
Publication Date
October 20, 1992
Inventor
Paul T Lin
Austin
TX, US
Michael B McShane
Austin
TX, US
Agent
Patricia S Goddard
Assignee
Motorola
IL, US
IPC
H01L 23/12
H01L 23/02
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