05148266 is referenced by 531 patents and cites 41 patents.

A semiconductor chip assembly is mounted to contact pads in a compact area array. An interposer is disposed between the chip and the substrate. The contacts on the chip are connected to terminals on the interposer by flexible leads extending through apertures in the interposer. The terminals on the interposer in turn are bonded to the contact pads on the substrate. Flexibility of the leads permits relative movement of the contacts on the chip relative to the terminals and the contact pads of the substrate and hence relieves the stresses caused by differential thermal expansion. The arrangement provides a compact structure similar to that achieved through flip-chip bonding, but with markedly increased resistance to thermal cycling damage.

Title
Semiconductor chip assemblies having interposer and flexible lead
Application Number
7/586758
Publication Number
5148266
Application Date
September 24, 1990
Publication Date
September 15, 1992
Inventor
Thomas H DiStefano
Bronxville
NY, US
Igor Y Khandros
Peekskill
NY, US
Agent
Lerner David Littenberg Krumholz & Mentlik
Assignee
IST Associates
NY, US
IPC
H01L 23/14
H01L 23/12
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