05144747 is referenced by 88 patents and cites 19 patents.

A multichip integrated circuit package comprises a substrate having a flat upper surface to which is affixed one or more integrated circuit chips having interconnection pads. A polymer encapsulant completely surrounds the integrated circuit chips. The encapsulant is provided with a plurality of via openings therein to accommodate a layer of interconnection metallization. The metallization serves to connect various chips and chip pads with the interconnection pads disposed on the chips. In specific embodiments, the module is constructed to be repairable, have high I/O capability with optimal heat removal, have optimized speed, be capable of incorporating an assortment of components of various thicknesses and function, and be hermetically sealed with a high I/O count. Specific processing methods for each of the various module features are described herein, along with additional structural enhancements.

Title
Apparatus and method for positioning an integrated circuit chip within a multichip module
Application Number
7/676938
Publication Number
5144747
Application Date
March 27, 1991
Publication Date
September 8, 1992
Inventor
Charles W Eichelberger
Schenectady
NY, US
Agent
Heslin & Rothenberg
Assignee
Integrated System Assemblies Corporation
MA, US
IPC
B23P 19/00
H05K 3/30
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