05140405 is referenced by 117 patents and cites 13 patents.

An semiconductor assembly includes at least one die having substantially planar first and second engagement surfaces and external edges which define a die shape. A base having an opening formed therein receives the die. The base opening has peripheral edges which define an opening shape and size which is complementary to the die external shape. The opening edges engage the die edges to spatially fix the die in a selected orientation in a plane parallel to the die first planar engagement surface. An interconnecting plate has at least one substantially planar engagement surface facing the first planar engagement surface of the die received within the base opening. At least one conductive pad on the plate planar engagement surface is spatially aligned or registered with a corresponding conductive pad on the first engagement surface of the die. A sheet of anisotropically conductive elastomeric material is interposed between the base and interconnecting plate between the first engagement surface of the die and engagement surface of the interconnecting plate. The base and interconnecting plate are clamped relative to one another in selected registration, sandwiching the anisotropically conductive elastomeric material therebetween. This conductively engages the at least one conductive pad of the die with the at least one conductive pad of the interconnecting plate through the sheet of anisotropically conductive elastomeric material.

Title
Semiconductor assembly utilizing elastomeric single axis conductive interconnect
Application Number
575179
Publication Number
5140405
Application Date
March 29, 1991
Publication Date
August 18, 1992
Inventor
George P McGill
Boise
ID, US
Warren M Farnworth
Nampa
ID, US
Jerry M Brooks
Boise
ID, US
Jerrold L King
Boise
ID, US
Agent
Wells St John & Roberts
Assignee
Micron Technology
ID, US
IPC
H01R 4/58
H05K 7/02
H01L 23/42
H01L 23/48
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