05138434 is referenced by 217 patents and cites 7 patents.

A logic module design is disclosed which incorporates an unencapsulated wafer section or sections. The disclosed module is an improvement over previous designs in that it is less expensive and easier to manufacture due to the reduced number of components and the complexity of the components, is faster and consumes less power because of its shorter trace lengths and smaller size, and is more reliable as a result of its greatly reduced number of interconnects.

Title
Packaging for semiconductor logic devices
Application Number
7/644146
Publication Number
5138434
Application Date
January 22, 1991
Publication Date
August 11, 1992
Inventor
Tim J Corbett
Boise
ID, US
Alan G Wood
Boise
ID, US
Agent
Stanley N Protigal
Assignee
Micron Technology
ID, US
IPC
H01L 23/02
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