05135608 is referenced by 75 patents and cites 9 patents.

A process and apparatus for producing semiconductor integrated circuit devices wherein the dry processing and the wet processing are continuously effected for the wafers to be processed, and the wafers are transferred between these processings under a vacuum condition or in a purging gas without being allowed to come in contact with the open air, to avoid adverse effects that will be caused by the open air.

Title
Method of producing semiconductor devices
Application Number
7/550694
Publication Number
5135608
Application Date
July 10, 1990
Publication Date
August 4, 1992
Inventor
Ken Okutani
Fussa
JP
Agent
Antonelli Terry Stout & Kraus
Assignee
Hitachi
JP
IPC
C23F 1/00
C03C 15/00
B44C 1/22
H01L 21/306
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