05123850 is referenced by 193 patents and cites 7 patents.

Disclosed is a burn-in test socket which serves as a temporary package for integrated circuit die, multichip hybrid or a complete wafer without damaging the bonding pads or insulating passivation on the die during test and burn-in.

Title
Non-destructive burn-in test socket for integrated circuit die
Application Number
505743
Publication Number
5123850
Application Date
June 7, 1991
Publication Date
June 23, 1992
Inventor
Arthur M Wilson
Dallas
TX, US
Dean L Frew
Garland
TX, US
Randy Johnson
Carrollton
TX, US
Richard A Elder
Dallas
TX, US
Agent
Richard L Donaldson
B Peter Barndt
Assignee
Texas Instruments Incorporated
TX, US
IPC
H05K 1/00
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