A flexible modular interconnect system is provided which utilizes a backplane having a plurality of module receiving slots and a plurality of circuit modules, selected ones of the circuit modules being mounted in at least selected ones of the slots. The modules may be of a variety of different types. First and second switches are provided for each circuit module with selected lines from module logic being connected to each of the switches. The first and second switches for each module are interconnected and the first switch for the selected modules are connected to the second switch for adjacent modules. Selected information concerning each module is provided to each adjacent module and control logic is provided which is responsive at least in part to the received information concerning the adjacent module for controlling the state of an appropriate switch. The switches may also be controlled from an external source. By selectively controlling the state of the switches, the modules may be flexibly interconnected.