05110438 is referenced by 59 patents and cites 12 patents.

The reduced pressure surface treatment apparatus according the present invention comprises at least one vacuum chamber and an exhaust unit and a gas supply unit connected thereto, and it is characterized in that it is provided with a holder to hold the specimen, means to bombard the specimen with ions without depositing a thin film on said specimen surface, and means to control kinetic energy of said ions to a small value. The reduced pressure surface treatment method of this invention is characterized in that substances adsorbed on the wafer surface or natural oxide film layers are removed by impinging ions on the wafer surface under a vacuum condition.

Title
Reduced pressure surface treatment apparatus
Application Number
7/536548
Publication Number
5110438
Application Date
July 10, 1990
Publication Date
May 5, 1992
Inventor
Masaru Umeda
Tokyo
JP
Tadashi Shibata
Sendai
JP
Tadahiro Ohmi
1-17-301, Komegabukuro 2-chome, Aoba-ku, Sendai-shi, Miyagi-ken 980
JP
Agent
Baker & Daniels
Assignee
Tadahiro Ohmi
JP
IPC
C23F 4/00
H05H 1/46
View Original Source