05106461 is referenced by 221 patents and cites 22 patents.

A multi-layer interconnect structure of alternating dielectric (e.g., polyimide) and metal (e.g., copper) is built on a substrate supporting a continuous layer of metal. This metal layer is used as an electrode for plating vias through all the dielectric layers. Once the desired number of layers are formed, the substrate is removed and the continuous metal layer is patterned. Solid metal vias having nearly vertical side walls can be stacked vertically, producing good electrical and thermal transfer paths and permitting small, closely-spaced conductors. Further, by mixing geometrical shapes of conductors, a variety of useful structures can be achieved, such as controlled impedance transmission lines and multiconductor TAB tape with interconnects on tape of different dimensions than TAB fingers.

Title
High-density, multi-level interconnects, flex circuits, and tape for tab
Application Number
333179
Publication Number
5106461
Application Date
December 21, 1990
Publication Date
April 21, 1992
Inventor
Stephen D Senturia
Boston
MA, US
David Volfson
Worcester
MA, US
Agent
Wolf Greenfield & Sacks
Assignee
Massachusetts Institute of Technology
MA, US
IPC
C25D 5/00
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