05103168 is referenced by 27 patents and cites 2 patents.

To prevent degradation of the connectors which connect a driver board to a carrier board, the present invention stress testing equipment positions its connectors at the rear of a moderate temperature section, away from a high temperature oven chamber of the testing equipment. By sealing the interface barrier between the high temperature chamber and the moderate temperature section and by circulating cool air through the moderate temperature section, a temperature gradient is effected along the length of the portion of the carrier board that is located within the moderate temperature section. Accordingly, the connectors located at the interface between the moderate temperature section and the ambient temperature section no longer are exposed to a high temperature environment, thereby no longer succumbing to material fatigue or degradation, albeit the electronic components carried on the portion of the carrier card that is exposed to the high temperature environment in the oven chamber continue to be stress tested in the high temperature environment.

Title
Stress testing equipment with an integral cooling plenum
Application Number
7/263453
Publication Number
5103168
Application Date
October 27, 1988
Publication Date
April 7, 1992
Inventor
Francis J Fuoco
Commack
NY, US
Agent
Pollock VandeSande & Priddy
Assignee
Grumman Aerospace Corporation
NY, US
IPC
G01R 15/12
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