05097890 is referenced by 48 patents and cites 14 patents.

A cooling system is disclosed which is incorporated in a heat treating apparatus for use in a manufacturing process of a semiconductor device etc. The heat treating apparatus includes a reaction tube for receiving products to be heat treated in its uniformly heated zone, and a heater which surrounds the reaction tube. Inlet means for blowing a cooling fluid and exhaust means for collecting that cooling fluid which is heated after the cooling function thereof has been achieved are provided. The fluid is blown from the inlet means around the reaction tube, substantially perpendicular to the axis of the reduction tube, and as a result, a flow of cooling fluid from the inlet means toward the exhaust means is established beyond the length of the uniformly heated zone, thus the entire reaction zone within the reaction tube is uniformly cooled.

Title
Heat treating apparatus with cooling fluid nozzles
Application Number
367313
Publication Number
5097890
Application Date
December 10, 1990
Publication Date
March 24, 1992
Inventor
Ken Nakao
Sagamihara
JP
Agent
Oblon Spivak McClelland Maier & Neustadt
Assignee
Tel Sagami
JP
IPC
F27D 9/00
F27B 5/16
H05B 3/64
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