05081563 is referenced by 137 patents and cites 30 patents.

An electronic component package, including: a multilayer ceramic or glass-ceramic substrate formed of a stacked plurality of generally parallel signal and insulating layers, each of the signal layers comprising an electrically conductive pattern; a cavity in a surface of the substrate sized to accommodate an electronic component with a planar surface of the electronic component disposed substantially planar with the surface of the substrate; and a plurality of electrical conductors extending from the surface of the substrate to selected ones of the signal layers for connecting the electronic component to the signal layers. Thin film wiring is provided for connecting the electronic component to the substrate.

Title
Multi-layer package incorporating a recessed cavity for a semiconductor chip
Application Number
7/516011
Publication Number
5081563
Application Date
April 27, 1990
Publication Date
January 14, 1992
Inventor
Richard H McMaster
Wappingers Falls
NY, US
George C Feng
Fishkill
NY, US
Bai Cwo Feng
Tarrytown
NY, US
Agent
Harold Huberfeld
Jeffrey L Brandt
Assignee
International Business Machines Corporation
NY, US
IPC
H05K 1/11
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