05074947 is referenced by 143 patents and cites 1 patents.

A method is presented for interconnecting bond pads of a flip chip with bond pads of a substrate by an electrically conductive polymer. An organic protective layer is selectively formed over a surface of a flip chip to thereby leave exposed bond pads on the flip chip. Electrically conductive polymerizable precursor is formed on the bond pads extending to a level beyond the organic protective layer to form bumps. The bumps are aligned with bond pads of a substrate and then contacted to those bond pads. The bumps can be polymerized either before or after contacting the bumps to the bond pads of the substrate to form electrically conductive interconnections between the bond pads of the flip chip and the bond pads of the substrate.

Title
Flip chip technology using electrically conductive polymers and dielectrics
Application Number
7/452191
Publication Number
5074947
Application Date
December 18, 1989
Publication Date
December 24, 1991
Inventor
Frank W Kulesza
Winchester
MA, US
Richard H Estes
Pelham
NH, US
Agent
Hamilton Brook Smith & Reynolds
Assignee
Epoxy Technology
MA, US
IPC
C09J 5/02
View Original Source