05069002 is referenced by 197 patents and cites 13 patents.

An apparatus for detecting a planar endpoint on a semiconductor wafer during mechanical planarization of the wafer. The planar endpoint is detected by sensing a change in friction between the wafer and a polishing surface. This change of friction may be produced when, for instance, an oxide coating of the wafer is removed and a harder material is contacted by the polishing surface. In a preferred form, the change in friction is detected by rotating the wafer and polishing surface with electric motors and measuring current changes on one or both of the motors. This current change can then be used to produce a signal to operate control means for adjusting or stopping the process.

Title
Apparatus for endpoint detection during mechanical planarization of semiconductor wafers
Application Number
7/686686
Publication Number
5069002
Application Date
April 17, 1991
Publication Date
December 3, 1991
Inventor
Trung T Doan
Boise
ID, US
Laurence D Schultz
Boise
ID, US
Gurtej S Sandhu
Boise
ID, US
Agent
Albert M Crowder
Assignee
Micron Technology
ID, US
IPC
H01L 21/304
B24B 49/16
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