05067007 is referenced by 177 patents and cites 17 patents.

Attempts have been made to increase the number of pins of packages accompanying the trend toward fabricating integrated circuits highly densely and in smaller sizes. The present invention provides technology for improving reliability in fabricating packages of the surface-mounted type that have increased number of pins. That is, when the packages are mounted on the wiring substrate, the lead pins that receive load from the axial direction exhibit bending strength which is smaller than the junction strength of solder at the junction portions. To achieve this object, the lead pins are made of a material having large resiliency such as a fiber-reinforced material, a transformation pseudo elastic material, an ultra-high tension material, or a heat-resistant ultra-high tension material.

Title
Semiconductor device having leads for mounting to a surface of a printed circuit board
Application Number
363750
Publication Number
5067007
Application Date
January 24, 1991
Publication Date
November 19, 1991
Inventor
Masayuki Kawashima
Higashimurayama
JP
Hiroshi Tachi
Akishima
JP
Kazutoshi Kubo
Akishima
JP
Takayuki Okinaga
Akishima
JP
Yuuji Shirai
Kodaira
JP
Seiji Miyamoto
Fuchuu
JP
Takeo Yamada
Koganei
JP
Kunizo Sahara
Nishitama
JP
Shigeo Kuroda
Ohme
JP
Mitsuo Usami
Ohme
JP
Takashi Kumagai
Isehara
JP
Masao Kato
Hadano
JP
Kanji Otsuka
Higashiyamato
JP
Agent
Pennie & Edmonds
Assignee
Hitachi VLSI Engineering
JP
Hitachi
JP
IPC
H01L 21/60
H01L 23/12
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