05055838 is referenced by 53 patents and cites 3 patents.

A high-performance single-crystal silicon tactile imaging array organized in a X-Y matrix of capacitor elements. Metallic column lines are formed on a glass support substrate, while the row lines are formed from a contiguous chain of doubly-supported bridge structures, with one such structure for each sensing element. All of the bridge structures are simultaneously fabricated from a single-crystal silicon semiconductor wafer using a two-step boron diffusion process, followed by a silicon-to-glass electrostatic bonding step and subsequent unmasked wafer dissolution. Each bridge structure has a thick center plate for the sense capacitor supported by thinner beams connected to adjacent row single-crystal silicon support rails bonded to the glass substrate. The force sensitivity and maximum operating range of the tactile imager can be selected over a very wide range by appropriately setting the dimensions of these thinner support beams. The resulting imager is rugged, of high resolution and high density, and is inherently stable over time and temperature.

Title
Silicon tactile imaging array and method of making same
Application Number
7/282052
Publication Number
5055838
Application Date
December 9, 1988
Publication Date
October 8, 1991
Inventor
Kenichiro Suzuki
Kanagawa
JP
Kensall D Wise
Ann Arbor
MI, US
Agent
Harness Dickey & Pierce
Assignee
The Regents of the University of Michigan
MI, US
IPC
H03K 17/94
G08C 19/10
View Original Source